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Practical guide to the packaging of electronics: thermal and mechanical design and analysis
Material type:
TextPublication details: New York Marcel Dekker 2003Edition: Description: x, 202pISBN: - 0-8247-0865-2
- 621.39:004.3'142
| Item type | Current library | Call number | Status | Date due | Barcode |
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University Library | 621.39:004.3'142 JAM (Browse shelf(Opens below)) | Available | 00054047 |
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| 621.39 VAC Optical networking best practices handbook | 621.39 YAN Multicarrier communications | 621.39 YU Entropy and information optics | 621.39:004.3'142 JAM Practical guide to the packaging of electronics: thermal and mechanical design and analysis | 621.39:004.77 Handbook of sensor networks | 621.39:004.77 BIN Emerging technologies in wireless LANs | 621.39:004.77 CAL Wireless sensor networks: architectures and protocols |
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