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Polymer materials for electronic applications based on a symposium sponsored by the Division of Organic Coatings and Plastics Chemistry at the second chemical congress of the North American continent (180th ACS national meeting), Las Vegas, Nevada, August 26-27, 1980 Eugene D. Feit
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TextPublication details: Washington, D.C. : American Chemical Society, 1982.Description: x, 256 p. : ill. ; 24 cmISBN: - 0841207151
- 678.06:621.3 FEI
| Item type | Current library | Call number | Status | Date due | Barcode |
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Polymer Science and Rubber Technology | 678.06:621.3 FEI (Browse shelf(Opens below)) | Available | PS000873 |
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| 678.06:62 HTO Microelectronic polymers | 678.06:62 JAR Application of polymeric reinforcement in soil retaining structures | 678.06:62 LUI Applications of high temperature polymers | 678.06:621.3 FEI Polymer materials for electronic applications | 678.06:66 HIL Glass reinforced polyester systems | 678.06:66 JEN Polymeric carbons-carbon fibre, glass and char | 678.06:66 SCH Glass |
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