Shieh,Wei T <br/><br/>
Microelectronic Packaging Technology,  materials and processes  proceedings of the second ASM International Electronic Materials and Processing Congress Philadelphia, April 24-28,1989. 

 - Ohio  ASM International  1989 
 - xi,479p. 
<br/><br/><label>ISBN: </label>0871703599 
<br/><br/><label>Subjects--Index Terms: </label>microelectronic packaging technology 
<br/><br/><label>Dewey Class. No.: </label>621.381 046  / ASMI