TY  - BOOK
AU  - Shieh,Wei T
TI  - Microelectronic Packaging Technology,  materials and processes: proceedings of the second ASM International Electronic Materials and Processing Congress Philadelphia, April 24-28,1989
SN  - 0871703599
U1  - 621.381 046 
PY  - 1989///
CY  - Ohio
PB  - ASM International
KW  - microelectronic packaging technology
ER  -