Morris,James E <br/><br/>
Electronics packaging forum  multichip module technology issues 

 - New York  The IEEE Inc.  1994 
 - vii,392p. 
<br/><br/><label>ISBN: </label>078030439Y 
<br/><br/><label>Subjects--Index Terms: </label>electronics packaging 
<br/><br/><label>Dewey Class. No.: </label>621.381 046  / MOR