Johnson,Wayne R <br/><br/>
Multichip modules   systems advantages, major construction, and materials technologies 

 - New York  The Institute of Electrical and Electronics Engineer's Inc.  1991 
 - ix,603p. 
<br/><br/><label>ISBN: </label>08794267x 
<br/><br/><label>Subjects--Index Terms: </label>multichip modules  microelectronic packaging 
<br/><br/><label>Dewey Class. No.: </label>621.381 046  / JOH