TY  - BOOK
AU  - Johnson,Wayne R
AU  - Teng,Robert K F
TI  - Multichip modules : systems advantages, major construction, and materials technologies
SN  - 08794267x
U1  - 621.381 046 
PY  - 1991///
CY  - New York
PB  - The Institute of Electrical and Electronics Engineer's Inc.
KW  - multichip modules
KW  - microelectronic packaging
ER  -