| 000 | 00576nam a22001577a 4500 | ||
|---|---|---|---|
| 005 | 20220518143137.0 | ||
| 008 | 100623t xxu||||| |||| 00| 0 eng d | ||
| 020 | _a0871703599 | ||
| 082 |
_a621.381 046 _bASMI |
||
| 100 |
_aShieh,Wei T _eEditor |
||
| 245 |
_aMicroelectronic Packaging Technology, materials and processes _bproceedings of the second ASM International Electronic Materials and Processing Congress Philadelphia, April 24-28,1989. |
||
| 260 |
_aOhio _bASM International _c1989 |
||
| 300 | _axi,479p. | ||
| 653 | _amicroelectronic packaging technology | ||
| 942 | _cBK | ||
| 999 |
_c223158 _d223158 |
||