| 000 | 00566nam a22001697a 4500 | ||
|---|---|---|---|
| 005 | 20220518143909.0 | ||
| 008 | 110517t xxu||||| |||| 00| 0 eng d | ||
| 020 | _a08794267x | ||
| 082 |
_a621.381 046 _bJOH |
||
| 100 |
_aJohnson,Wayne R _eEditor |
||
| 245 |
_aMultichip modules _bsystems advantages, major construction, and materials technologies |
||
| 260 |
_aNew York _bThe Institute of Electrical and Electronics Engineer's Inc. _c1991 |
||
| 300 | _aix,603p. | ||
| 653 |
_amultichip modules _amicroelectronic packaging |
||
| 700 | _aTeng,Robert K F | ||
| 942 | _cBK | ||
| 999 |
_c225469 _d225469 |
||