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Microelectronic Packaging Technology, materials and processes

Shieh,Wei T

Microelectronic Packaging Technology, materials and processes proceedings of the second ASM International Electronic Materials and Processing Congress Philadelphia, April 24-28,1989. - Ohio ASM International 1989 - xi,479p.

ISBN: 0871703599

Subjects--Index Terms: microelectronic packaging technology

Dewey Class. No.: 621.381 046 / ASMI

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