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Microelectronic Packaging Technology, materials and processes proceedings of the second ASM International Electronic Materials and Processing Congress Philadelphia, April 24-28,1989.

By: Material type: TextTextPublication details: Ohio ASM International 1989Description: xi,479pISBN:
  • 0871703599
Subject(s): DDC classification:
  • 621.381 046 ASMI
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University Library
Cochin University of Science and Technology
Kochi-682 022, Kerala, India