Microelectronic Packaging Technology, materials and processes (Record no. 223158)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00576nam a22001577a 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220518143137.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 100623t xxu||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0871703599 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 046 |
| Item number | ASMI |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Shieh,Wei T |
| Relator term | Editor |
| 245 ## - TITLE STATEMENT | |
| Title | Microelectronic Packaging Technology, materials and processes |
| Remainder of title | proceedings of the second ASM International Electronic Materials and Processing Congress Philadelphia, April 24-28,1989. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc. | Ohio |
| Name of publisher, distributor, etc. | ASM International |
| Date of publication, distribution, etc. | 1989 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xi,479p. |
| 653 ## - INDEX TERM--UNCONTROLLED | |
| Uncontrolled term | microelectronic packaging technology |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Books |
No items available.